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An Experimental Study On Thermal Bonding Effects Of PMMA Based Micro-devices Using Hot Embossing

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An Experimental Study On Thermal Bonding Effects Of PMMA Based Micro-devices Using Hot Embossing

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dc.contributor.author Sood, Varun en_US
dc.date.accessioned 2008-08-08T02:31:02Z
dc.date.available 2008-08-08T02:31:02Z
dc.date.issued 2008-08-08T02:31:02Z
dc.date.submitted December 2007 en_US
dc.identifier.other DISS-1912 en_US
dc.identifier.uri http://hdl.handle.net/10106/899
dc.description.abstract Basic configuration and functioning of various subsystems of a developed HEMM system for thermal bonding are discussed. The bond strength and micro channel geometry degradations dependence on controlled process parameters in thermal bonding using hot embossing has been investigated. The process parameters examined were bonding temperature, bonding or applied load and holding time. Polymeric substrates with different feature dimensions and thickness were embossed and bonded using hot embossing technology. The feature dimensions before and after bonding were examined to assess the geometry changes as functions of the bonding process. This assessment could provide guidance during the design phase of micro-fluidic devices considering the bonding step. The results from the experiments show that high bond strength can be obtained at higher temperature and pressure and longer holding time. Also, to obtain minimum degradation, the bonding temperature and pressure should be kept low with longer holding times. The experiments also suggest combination of input parameters to obtain good bond strength and minimum degradations. ANOVA analysis of the experimental data was performed to find the regression models to estimate the outputs knowing the controlled inputs and to find the sensitivity of controlled process parameters on bond strength and channel degradations. The models are linearized to estimate the input process to obtain the desired bond strength or channel geometry. en_US
dc.description.sponsorship Shiakolas, Panayiotis en_US
dc.language.iso EN en_US
dc.publisher Mechanical Engineering en_US
dc.title An Experimental Study On Thermal Bonding Effects Of PMMA Based Micro-devices Using Hot Embossing en_US
dc.type M.S. en_US
dc.contributor.committeeChair Shiakolas, Panayiotis en_US
dc.degree.department Mechanical Engineering en_US
dc.degree.discipline Mechanical Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S. en_US
dc.identifier.externalLink https://www.uta.edu/ra/real/editprofile.php?onlyview=1&pid=38
dc.identifier.externalLinkDescription Link to Research Profiles

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