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Performance Optimization Of Multi-core Processors Using Core Hopping - Thermal and Structural

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Performance Optimization Of Multi-core Processors Using Core Hopping - Thermal and Structural

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dc.contributor.author Lingampalli, Sunil en_US
dc.date.accessioned 2011-10-11T20:48:50Z
dc.date.available 2011-10-11T20:48:50Z
dc.date.issued 2011-10-11
dc.date.submitted January 2011 en_US
dc.identifier.other DISS-11309 en_US
dc.identifier.uri http://hdl.handle.net/10106/6179
dc.description.abstract As the work load on the single core processor increases, it's processing speed increases resulting in increased power densities and die temperatures. The increase in die temperature results in decreased performance and reliability and increased leakage currents and cooling costs. In order to decrease the work load and the cooling cost on the single core processor, multi-core processors have been implemented. Multicore Processors also known as Chip Multi Processors (CMP's) are the processors which contain two or more independent cores on a chip. In CMPs, if one core reaches its critical temperature, the workload is transferred to the other. This phenomenon is termed as core hopping. Also, the non-uniform power distribution across the die is not uniform, resulting in hot spots. Core hopping results in the uniform distribution of the work load among the many cores and leads to performance and reliability improvement. The demand for greater performance in applications involving high levels of computing has resulted in many cores being put on a single chip. Every succeeding processor is predicted to hold double the number of cores than previous one. In this study, core hopping for CMPs is analyzed and thermal analysis of the chip is performed using ANSYS. Furthermore, the hop sequence will be optimized as a function of chip temperature distribution and thermo-mechanical analysis of the package will be carried out to estimate its structural integrity. en_US
dc.description.sponsorship Agonafer, Dereje en_US
dc.language.iso en en_US
dc.publisher Mechanical Engineering en_US
dc.title Performance Optimization Of Multi-core Processors Using Core Hopping - Thermal and Structural en_US
dc.type M.S. en_US
dc.contributor.committeeChair Agonafer, Dereje en_US
dc.degree.department Mechanical Engineering en_US
dc.degree.discipline Mechanical Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S. en_US

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