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Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders

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Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders

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dc.contributor.author Adeogba, Tonye en_US
dc.date.accessioned 2010-07-19T19:54:30Z
dc.date.available 2010-07-19T19:54:30Z
dc.date.issued 2010-07-19
dc.date.submitted January 2009 en_US
dc.identifier.other DISS-10575 en_US
dc.identifier.uri http://hdl.handle.net/10106/4868
dc.description.abstract This study presents findings on the nano-mechanical properties of binary and ternary (Cu, Ag) - Sn Solders. Nanoindentation with a cube corner tip was used on Sn-Ag and SAC405 alloy compositions to investigate the effect of reflow process variables on the properties of hardness and reduced modulus on a nanoscale. The specimens tested were sandwich solder joints where Cu was the substrate. While the reflow variables of cooling rate and reflow time were found to cause changes in IMC morphology and solder matrix microstructure, the nano hardness and reduced modulus were independent of these variables. Low max loads coupled with a cube corner indenter tip yielded interesting load-depth curve results on the solder matrix. en_US
dc.description.sponsorship Aswath, Pranesh en_US
dc.language.iso EN en_US
dc.publisher Materials Science & Engineering en_US
dc.title Effect Of Reflow Variables On The Nanoscale Mechanical Properties Of Lead Free Solders en_US
dc.type M.S. en_US
dc.contributor.committeeChair Aswath, Pranesh en_US
dc.degree.department Materials Science & Engineering en_US
dc.degree.discipline Materials Science & Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S. en_US
dc.identifier.externalLink https://www.uta.edu/ra/real/editprofile.php?onlyview=1&pid=5
dc.identifier.externalLinkDescription Link to Research Profiles

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