MEMS Packaging: Fluxless Soldering and Reliability Assessment

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MEMS Packaging: Fluxless Soldering and Reliability Assessment

Show simple item record Patil, Amit L en_US 2007-08-23T01:56:34Z 2007-08-23T01:56:34Z 2007-08-23T01:56:34Z August 2006 en_US
dc.identifier.other DISS-1458 en_US
dc.description.abstract This thesis presents process development and reliability assessment of the fluxless packaging of the MEMS devices. This packaging consists of metallized Kovar package with side wall of same material and circular holes for the optical fiber interconnect between the microstructures on the chip and the macro-environment. The back of the MEMS chip and the soldering part of the optical fiber is metallized. A thin solder perform is placed between the chip and the metallized package to attach the chip and a circular solder perform is used to attach the fiber to the metal substrate. The soldering process is fluxless hence organic free. Selection of soldering environment and solders is studied. Different process parameters are evaluated to achieve the fluxless soldering. Once the bonding between the die and the package and the fiber and the package are achieved the joining is to be assessed with different reliability tests like die shear test, fiber pull test, impact and vibration test. en_US
dc.description.sponsorship Agonafer, Dereje en_US
dc.language.iso EN en_US
dc.publisher Mechanical Engineering en_US
dc.title MEMS Packaging: Fluxless Soldering and Reliability Assessment en_US
dc.type M.S. en_US
dc.contributor.committeeChair Agonafer, Dereje en_US Mechanical Engineering en_US Mechanical Engineering en_US University of Texas at Arlington en_US masters en_US M.S. en_US
dc.identifier.externalLinkDescription Link to Research Profiles

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