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Reliability Of Lead-free Solder Under Cyclic Bending

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Reliability Of Lead-free Solder Under Cyclic Bending

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dc.contributor.author Zahedi, Fahad en_US
dc.date.accessioned 2007-08-23T01:56:15Z
dc.date.available 2007-08-23T01:56:15Z
dc.date.issued 2007-08-23T01:56:15Z
dc.date.submitted December 2005 en_US
dc.identifier.other DISS-1220 en_US
dc.identifier.uri http://hdl.handle.net/10106/192
dc.description.abstract To characterize particular compositions of lead free solder, four point cyclic bending test was conducted to study the affects of accelerated stress testing on the package to board interconnects. Nine CTBGA packages with 0.5 mm ball pitch and 12 x 12 mm package size were reflowed on 8 layered PWB's using solder balls with lead free composition alloys and different PWB copper pad finishes. The boards were subjected to test conditions based on proposed standards by JEDEC. Strain gages were mounted at different locations on the test boards as well as on bare boards in order to observe the difference caused in the board strain use this information for simulation purposes. Failure analysis results have been presented as part of the work on the characterization of the various compositions of lead free alloys. This work reports and explains some of the observations found from the results of this test. en_US
dc.description.sponsorship Agonafer, Dereje en_US
dc.language.iso EN en_US
dc.publisher Mechanical Engineering en_US
dc.title Reliability Of Lead-free Solder Under Cyclic Bending en_US
dc.type M.S.M.E. en_US
dc.contributor.committeeChair Agonafer, Dereje en_US
dc.degree.department Mechanical Engineering en_US
dc.degree.discipline Mechanical Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S.M.E. en_US
dc.identifier.externalLink https://www.uta.edu/ra/real/editprofile.php?onlyview=1&pid=4
dc.identifier.externalLinkDescription Link to Research Profiles

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