Sealing And Lamination Of Microfluidic Devices

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Sealing And Lamination Of Microfluidic Devices

Show simple item record Oliver, Christopher Ryan en_US 2008-09-17T23:35:10Z 2008-09-17T23:35:10Z 2008-09-17T23:35:10Z July 2008 en_US
dc.identifier.other DISS-2227 en_US
dc.description.abstract A difficult problem facing microfluidic manufacturing of devices remains that often material requirements force device designers to choose materials that are difficult to bond, seal or enclose. Examples of these materials include the Polyolefin family such as HDPE (High Density Polyethylene), PP (Polypropylene) or high performance polymers such as PEEK (Polyetheretherketone), Acetal or Polyimide. The problem arises from the chemical resistance of the materials making them ideal for processing corrosive chemicals but the same property reduces the effectiveness of laminates, surface bonding, surface coatings and solvents. To address this problem a methodology for sealing devices made of these materials is explored and results related to laminating similar substrates is presented. This is followed by suggestions for further study and potential improvements. en_US
dc.description.sponsorship Priest, John en_US
dc.language.iso EN en_US
dc.publisher Industrial & Manufacturing Engineering en_US
dc.title Sealing And Lamination Of Microfluidic Devices en_US
dc.type M.S.I.E. en_US
dc.contributor.committeeChair Priest, John en_US Industrial & Manufacturing Engineering en_US Industrial & Manufacturing Engineering en_US University of Texas at Arlington en_US masters en_US M.S.I.E. en_US
dc.identifier.externalLinkDescription Link to Research Profiles

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