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Experimental/computational Analysis Of Active Cooling Of Stacked Device Using Multidimensional Configured Thermoelectric Modules

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Experimental/computational Analysis Of Active Cooling Of Stacked Device Using Multidimensional Configured Thermoelectric Modules

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dc.contributor.author Patel, Vaidehi Bharat en_US
dc.date.accessioned 2012-07-25T19:10:11Z
dc.date.available 2012-07-25T19:10:11Z
dc.date.issued 2012-07-25
dc.date.submitted January 2012 en_US
dc.identifier.other DISS-11735 en_US
dc.identifier.uri http://hdl.handle.net/10106/11115
dc.description.abstract Stacked devices are currently used widely because of their smaller footprint and corresponding ability to accommodate heterogeneous devices such as memory and logic and enable a silicon efficiency greater than 100%. This configuration will results in thermal management challenges due to the torturous heat dissipation path. In addition, the non-uniformity in chip power distribution results in an increased spreading resistance as well as temperature gradient at the device level that can degrade performance and reliability. In this study the Thermoelectric Modules were configured in a multidimensional form surrounding a three dimensional cold core. The corresponding Computational Fluid Dynamics model is validated using the experimental data. en_US
dc.description.sponsorship Agonafer, Dereje en_US
dc.language.iso en en_US
dc.publisher Aerospace Engineering en_US
dc.title Experimental/computational Analysis Of Active Cooling Of Stacked Device Using Multidimensional Configured Thermoelectric Modules en_US
dc.type M.S. en_US
dc.contributor.committeeChair Agonafer, Dereje en_US
dc.degree.department Aerospace Engineering en_US
dc.degree.discipline Aerospace Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S. en_US

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