RESEARCH COMMONS
LIBRARY

Comparison Of Cooling Performance Of Overhead And Underfloor Supply With Rear Door Heat Exchanger In High Density Data Center Clusters

ResearchCommons/Manakin Repository

Comparison Of Cooling Performance Of Overhead And Underfloor Supply With Rear Door Heat Exchanger In High Density Data Center Clusters

Show simple item record

dc.contributor.author Udakeri, Ravi K en_US
dc.date.accessioned 2008-09-17T23:35:05Z
dc.date.available 2008-09-17T23:35:05Z
dc.date.issued 2008-09-17T23:35:05Z
dc.date.submitted July 2008 en_US
dc.identifier.other DISS-2195 en_US
dc.identifier.uri http://hdl.handle.net/10106/1082
dc.description.abstract The power trend for server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners (CRACs) providing cold air is a popular operating strategy. In prior work, numerous data center layouts employing raised floor plenum and the impact of design parameters such as plenum depth, ceiling height, cold isle location, tile openings and others on thermal performance of data center was presented. The air cooling of data center however, may not address the situation where more energy is expended in cooling infrastructure than the thermal load of data center. Revised power trend projections by ASHRAE TC 9.9 predict heat load as high as 5000W per square feet of compute servers' equipment footprint by year 2010. These trend charts also indicate that heat load per product footprint has doubled for storage servers during 2000-2004. For the same period, heat load per product footprint for compute servers has tripled. Amongst the systems that are currently available and being shipped, many racks exceed 20kW. Such high heat loads have raised concerns over limits of air cooling of data centers similar to air cooling of microprocessors. A hybrid cooling strategy that incorporates liquid cooling along with air cooling can be very efficient in such situations. The objective of this paper is to study and compare the performance of hybrid cooling solution in two widely used air supply configurations namely Overhead supply and Underfloor supply focusing on rack inlet temperature. The numerical models of a representative data center employing Overhead and Underfloor supply with hot aisle-cold aisle arrangement are constructed using a commercial CFD code. The effect of these configurations on rack inlet temperature is discussed. en_US
dc.description.sponsorship Agonafer, Dereje en_US
dc.language.iso EN en_US
dc.publisher Mechanical Engineering en_US
dc.title Comparison Of Cooling Performance Of Overhead And Underfloor Supply With Rear Door Heat Exchanger In High Density Data Center Clusters en_US
dc.type M.S. en_US
dc.contributor.committeeChair Agonafer, Dereje en_US
dc.degree.department Mechanical Engineering en_US
dc.degree.discipline Mechanical Engineering en_US
dc.degree.grantor University of Texas at Arlington en_US
dc.degree.level masters en_US
dc.degree.name M.S. en_US
dc.identifier.externalLink https://www.uta.edu/ra/real/editprofile.php?onlyview=1&pid=4
dc.identifier.externalLinkDescription Link to Research Profiles

Files in this item

Files Size Format View
umi-uta-2195.pdf 1.186Mb PDF View/Open
1.186Mb PDF View/Open

This item appears in the following Collection(s)

Show simple item record

Browse

My Account

Statistics

About Us